The Guide to Electronics and Solder Joint Testing for QA & QC Purposes

The Guide to Electronics and Solder Joint Testing for QA & QC  Purposes – The destructive and non-destructive testing techniques available for electronics and solder joint quality assurance and control.

When you need to be certain the component or product you’re despatching conforms to specification, this guide explains your options.

If a failure has been identified, but the cause of that failure isn’t immediately apparent, this guide outlines what alternatives are available to you.

Covered in Guide to Electronics and Solder Joint Testing:

• The 6 most commonly used testing techniques in electronics QA/QC
• The circumstances under which each test is generally used
• A summary of what the test involves
• The advantages of each test and other applications for which it is appropriate
• The standards to which the tests are performed
• The sample sizes that can be used.

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