Low silver lead-free solders are second-generation Tin Silver Copper (SAC) alloy lead-free solders containing 0-1% silver rather than the conventional 3-4%. Typical formulations are SAC105, SAC0307 and SnCu+.
These technologies are being increasingly implemented globally for electronics assembly.
They have better shock resistance in BGA's used for portable products and are lower cost, particularly in wave and hand soldering.
Several variations are commercially available, differentiated mainly by use of different additive technologies to improve performance.This Knowledge Summary provides:
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